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Via Fundamentals & HDI Design
Begin by understanding the structural differences between staggered and stacked microvias and their roles in modern PCB designs. You’ll also explore how microvias enable compact, high‑density interconnect (HDI) layouts and why laser drilling is the preferred method for precision and reliability.
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Aspect Ratios and Manufacturability
Calculate via aspect ratios and their impact on plating, depth, and manufacturability. Compare staggered vs. stacked microvias, evaluate fabrication constraints on yield and cost, and apply Sierra Circuits’ tools with microsection analysis to validate thermal, electrical, and long‑term reliability.
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Design Trade‑Offs and Reliability Testing
Explore fabrication requirements for staggered and stacked microvias, weighing pros and cons against layout, yield, and cost. Use Sierra Circuits’ tools—current capacity, temperature rise, and microsection analysis—to validate thermal, electrical, and long‑term reliability.